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Semiconductor device fabrication
Results: 2185

#	Item
341	Nikon Mini Steppers For MEMS, LEDs, and More Nikon Mini Steppers Nikon Mini Steppers Add to Reading List Source URL: nikon.com Language: English - Date: 2014-04-09 03:14:53 Microtechnology Semiconductor device fabrication Nikon Wafer Microelectromechanical systems Technology Materials science Stepper
342	HDI Draper’s high-density interconnect technology utilizes our patented waferscale injection molding processes to create mechanically robust, miniature circuit boards compatible with state-of-the-art surface mount asse Add to Reading List Source URL: www.draper.com Language: English - Date: 2014-03-10 12:05:00 Electronic engineering Semiconductor device fabrication Electrical engineering Printed circuit board Wafer Flip chip Solder 100 micrometres Via Electronics manufacturing Electronics Electromagnetism
343	P2-80 Simulations of diffusive lithium evaporation onto the NSTX vessel walls D. P. Stotler a,∗ , C. H. Skinner a , W. R. Blanchard a , P. S. Krstic b H. W. Kugel a , H. Schneider a , L. E. Zakharov a , Add to Reading List Source URL: w3.pppl.gov Language: English - Date: 2010-10-29 11:08:00 Chemical elements Thin film deposition Fusion reactors Atmospheric thermodynamics Semiconductor device fabrication National Spherical Torus Experiment Lithium Helium Evaporation Chemistry Matter Physics
344	Photon Factory Activity Report 2009 #27 Part BSurface and Interface 2C/2008S2003 Interfacial reactions for Ru metal-electrode/HfSiON gate stack structures studied Add to Reading List Source URL: pfwww.kek.jp Language: English - Date: 2010-12-27 22:22:07 Semiconductor device fabrication Superhard materials Transistors Ceramic materials Atomic layer deposition High-k dielectric Ruthenium(IV) oxide Silicon dioxide Titanium nitride Chemistry Matter Electronic engineering
345	Microsoft Word - 1mm_spaceart_En.doc Add to Reading List Source URL: www.astro.mech.tohoku.ac.jp Language: English - Date: 2009-11-06 04:23:23 Technology Wafer Isotropic etching Etching Photolithography Semiconductor fabrication plant Semiconductor device fabrication Materials science Microtechnology
346	PLD Components ¾ Ideal for retrofit of existing or construction of new PLD systems. ¾ Reliable, robust designs backed by extensive research experience. Add to Reading List Source URL: www.neocera.com Language: English - Date: 2013-01-04 14:36:20 Physics Manufacturing Thin films Laser machining Pulsed laser deposition Thin film Feedthrough Vacuum Laser Technology Thin film deposition Semiconductor device fabrication
347	Photon Factory Activity Report 2008 #26 Part BSurface and Interface 2C/2008S2-003 In situ photoemission study of metal/Pr0.7Ca0.3MnO3 interfaces showing electricfield-induced resistance-switching behavior Add to Reading List Source URL: pfwww.kek.jp Language: English - Date: 2010-01-05 10:36:04 Condensed matter physics Ohmic contact Semiconductor device fabrication Aluminium X-ray absorption spectroscopy Chemistry Materials science Matter
348 $Technology / Materials science / Coatings / Thin films / Thin film / Pulsed laser deposition / Sputtering / Reflection high-energy electron diffraction / Layer / Semiconductor device fabrication / Chemistry / Thin film deposition$	Pulsed Laser Deposition - Sputtering Module Neocera is offering UHV compatible, advanced combination deposition tools integrating Pulsed Laser Deposition and Sputtering modules to create atomically clean, device quality Add to Reading List Source URL: www.neocera.com Language: English - Date: 2013-01-04 14:35:53 Technology Materials science Coatings Thin films Thin film Pulsed laser deposition Sputtering Reflection high-energy electron diffraction Layer Semiconductor device fabrication Chemistry Thin film deposition
349	6 Imaging and Optics Semiconducting diamond has attracted considerable attention as a material for power devices owing to its high breakdown characteristics and high carrier mobility in high-temperature, high-voltage en Add to Reading List Source URL: pfwww.kek.jp Language: English - Date: 2013-12-17 02:13:23 Semiconductor device fabrication Thin film deposition Crystallographic defects Coatings Superhard materials Epitaxy Chemical vapor deposition Dislocation Silicon carbide Chemistry Materials science Manufacturing
350	Photon Factory Activity Report 2004 #22 Part BSurface and Interface 1C/2002S2-002 Mechanism of ohmic-contact formation between Ti electrodes and AlxGa1-xN Add to Reading List Source URL: pfwww.kek.jp Language: English - Date: 2010-01-05 10:31:14 Materials science Ohmic contact Titanium nitride Gallium nitride Chemistry Semiconductor device fabrication Nitrides

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